0.12MM BGA Reballing Stencil Template Tin Net for iPhone A10/A9/A8 CPU

Price:   $4.99

  • History: 9 Orders
  • Shipping Weight: 0.009kg
  • Units in Stock: 9977
  • Model: VC713

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(complete orders today,deliverd around 27/11/2017 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
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  • Email us
    vipfixphone@gmail.com
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    The t0.12MM BGA Reballing Stencil is iPhone is universal iPhone reballing tool, it is designed to fix iphone CPU Wifi NAND Baseband Power audio IC Chip.  The BGA positioning Mold and tin planting tool is available for iPhone 6/6P/6S/6SP/7/7P , it will save both your time and effort to finish your iPhone BGA IC chip repair



    0.12MM BGA Reballing Stencil Template Tin Net for iPhone A10/A9/A8 CPU



    [ Optional Types]

    Optional 1:  A8 upper
    Optional 2:  A8 lower
    Optional 3:  A9 upper
    Optional 4:  A9 lower
    Optional 5:  A10 lower
    Optional 6:  iPhone 6 6P BGA Reballing Stencil for CPU Wifi NAND Baseband Power audio IC CHIP bga rework reballing
    Optional 7:  iPhone 6S 6SP BGA Reballing Stencil for CPU Wifi NAND Baseband Power audio IC CHIP bga rework reballing
    Optional 8:  iPhone 7 /7P BGA Reballing Stencil for CPU Wifi NAND Baseband Power audio IC CHIP bga rework reballing
     



    Prevent bulges BGA Reballing Stencil Template with ventilation hole.
     



    Features:

    1: with Cooling hole design, prevent bulges and avoid hump

    2: Top quality Steel sheet material, Not easily deformed

    3:  smooth wall of hole, easy to doing BGA Reballing