0.12MM BGA Reballing Stencil Template for iPhone A10 A9 A8 CPU

Price:   $4.99

  • History: 10 Orders
  • Shipping Weight: 0.009kg
  • Units in Stock: 9976
  • Model: VC713

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Please Choose Right Price Option (Min-Max):

  • A8 upper
  • A8 lower
  • A9 upper
  • A9 lower
  • A10 upper
  • A10 lower
  • 6 / 6P
  • 6P/6SP
  • 7 / 7P
(complete orders today,deliverd around 15/12/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    The 0.12MM BGA Reballing Stencil is iPhone is universal iPhone reballing tool, BGA reballing tool is designed to fix iphone CPU Wifi NAND Baseband Power audio IC Chip. The BGA positioning Mold and tin planting tool is available for iPhone 6/6P/6S/6SP/7/7P , it will save both your time and effort to finish your iPhone BGA IC chip repair



    0.12MM BGA Reballing Stencil Template for iPhone A10/A9/A8 CPU

    [ Optional Model]

    Optional 1:  A8 upper
    Optional 2:  A8 lower

    Optional 3:  A9 upper
    Optional 4:  A9 lower

    Optional 5:  A10 upper
    Optional 6:  A10 lower

    Optional 7:  iPhone 6 6P BGA Reballing Stencil for CPU Wifi NAND Baseband Power audio IC CHIP bga rework reballing
    Optional 8:  iPhone 6S 6SP BGA Reballing Stencil for CPU Wifi NAND Baseband Power audio IC CHIP bga rework reballing

    Optional 9:  iPhone 7 /7P BGA Reballing Stencil for CPU Wifi NAND Baseband Power audio IC CHIP bga rework reballing

     



    Prevent bulges BGA Reballing Stencil Template with ventilation hole.
     



    Features:

    1: with Cooling hole design, prevent bulges and avoid hump

    2: Top quality Steel sheet material, Not easily deformed

    3:  smooth wall of hole, easy to doing BGA Reballing