0.1mm iPhone 6s 6sp A9 CPU Reballing Stencil for iPhone IC Chip Repair

Price:   $29.99  $25.99-13%

  • History: 9 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 9984
  • Model: W024

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Please Choose Right Price Option (Min-Max):

  • A9-0.1mm (80*80mm)
  • A9-0.1mm (92*45mm)
  • A9-0.12mm (80*80mm)
  • A9-0.12mm (92*45mm)
(complete orders today,deliverd around 26/09/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    0.1mm iPhone 6s 6sp A9 CPU Reballing Stencil is iPhone HDD Nand / Baseband / eeprom ic repair BGA Chip rework tool. It is used for providing more convenient operation to make tin planting repairs on iPhone BGA chips. The reballing stencil is available for iPhone 6s and 6s plus.



    0.1mm iPhone 6s 6sp A9 CPU Reballing Stencil for iPhone IC Chip Repair


    [Optional Types]:

    Optional 1:  A9-0.1mm (80*80mm)
    Optional 2:  A9-0.1mm (92*45mm)
    Optional 3:  A9-0.12mm (80*80mm)
    Optional 4:  A9-0.12mm (92*45mm)


    Apple IC Chip BGA Reballing Stencil Kits Set Solder template for iphone 6s 6sp A9 CPU,  iPhone HDD Nand / Baseband / eeprom ic repair bga rework reballing

    http://www.vipprogrammer.com/images/uploads/iphone%206s%206sp%20A9%20CPU%20Plant%20Tin%20steel%20net.jpg

                                   http://www.vipprogrammer.com/images/uploads/iphone%206s%206sp%20A9%20CPU%20Plant%20Tin%20steel%20net_01.jpg

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