0.1mm Precison iPhone 6 6p A8 CPU Reballing Stencil Template

Price:   $29.99  $25.99-13%

  • History: 9 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 9985
  • Model: W023

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Please Choose Right Price Option (Min-Max):

  • A8-0.1mm (80*80mm)
  • A8-0.1mm (92*45mm)
  • A8-0.12mm (80*80mm)
  • A8-0.12mm (92*45mm)
(complete orders today,deliverd around 26/09/2018 )
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    Precision iPhone 6 6p A8 CPU Reballing Stencil is iPhone HDD Nand / Baseband / eeprom ic repair BGA Chip rework tool. It is used for providing more convenient operation for  tin planting repairs on iPhone BGA chips. The reballing stencil is available for iPhone 6 and 6 plus.



    0.1mm Precison iPhone 6 6p A8 CPU Reballing Stencil Template

    [Optional Types]:

    Optional 1:  A8-0.1mm (80*80mm)
    Optional 2:  A8-0.1mm (92*45mm)
    Optional 3:  A8-0.12mm (80*80mm)
    Optional 4:  A8-0.12mm (92*45mm)

    Apple IC Chip BGA Reballing Stencil  Solder template for iPhone 6 6p A8 CPU,  iPhone HDD Nand / Baseband / eeprom ic repair bga rework reballing