0.25mm Apple NAND BGA Reballing Stencil Template for iPad iPhone Chip Repair

Price:   $4.55

  • History: 9 Orders
  • Shipping Weight: 0.009kg
  • Units in Stock: 989
  • Model: VC918

(0 reviews)

Please Choose Right Price Option (Min-Max):

  • Option 1
  • Option 2
(complete orders today,deliverd around 28/02/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
  • New Products
    Mini Soldering Iron with Constant Temperature Controller for Fix Phone
    $19.00  $17.99-5%
    16-50W Electronic Soldering Iron for Fix Cell Phone Motherboard
    $5.50  $4.55-17%
    Lead Free Soldering Iron for Phone Fix Electric Solder Tool
    $18.00
    Microcomputer Intelligent Soldering Iron Tool for Fix Phone Motherboard
    $18.00
    • Details
    • Reviews
    • Tags
    • FAQ

    0.25mm Apple NAND BGA Reballing Stencil Template is iPhone and iPad motherboard repair tool, it is used to fix all series for all series iPhone and iPad NAND Flash IC. they are designed with holes for ventilation and heat dissipation to prevent any damages. The high quality 2-in-1 32/64bit Apple NAND BGA reballing stencil is a good assistant and solution for tin planting repairs.



    0.25mm Apple NAND BGA Reballing Stencil Template for iPad iPhone Chip Repair

     



    [Optional Type]

    Optional 1:  iPhone 6 NAND




    Optional 2:  iPhone 6S PCIE NAND