8 PCS Phone Fix Universal BGA Reballing Stencil for IC Soldering

Price:   $0.99

  • History: 2 Orders
  • Shipping Weight: 0.05kg
  • Units in Stock: 998
  • Model: FX062

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(complete orders today,deliverd around 26/02/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    8 Pieces Phone Fix Universal BGA Reballing Stencil are high quality mobile phone fix IC chip repair assistant, these stencils were made by high quality steel, which can be heated directely by the hot air gun , it is easy and quickly for reballing the BGA IC chips. The 0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.76mm cell phone reballing stencil will offer the best solution for phone IC chip repair.

    8 PCS Phone Fix Universal BGA Reballing Stencil for IC Soldering

    Universal steel for the repair of various BGA chips, such as notebook, desktop, XBOX, communication main board, North and South Bridge and graphics card, etc.

    Advantage:  the imported stainless steel is specially made by high quality thickness steel. It can be heated derectly by hot air gun, and the steel net is not easily deformed by heat. The reballing process can be carried out with the ordinary hot air gun.


    1. 8 stencils are in different sizes, suitable for chips in different sizes.
    2. Can be directly heated.
    3. Useful and economical accessories for BGA soldering.
    4. Durable in use.
    5. Suitable for reballing balls: 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.76mm.