BGA Reball Stencil iPhone A6 A7 A8 A9 CPU Upper Lower Tin Plate

Price:   $0.99

  • History: 9 Orders
  • Shipping Weight: 0.009kg
  • Units in Stock: 9981
  • Model: VC543

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(complete orders today,deliverd around 18/12/2017 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    BGA Reball Stencil Template is high quality iPhone BGA IC repair tool, it is designed to plant tin on iPhone BGA chip easily and quickly.  There are upper and lower tin plates to offer you more convenient  and easy reballing repair. This reballing tool is available for iPhone 5/5c/5s/6/6plus/6s/7/7plus.



    BGA Reball Stencil iPhone A6 A7 A8 A9 CPU Upper Lower Tin Plate
     

    [ Optional Types ]:

    Optional 1:  A6 upper
    Optional 2:  A6 lower
    Optional 3:  A7 upper
    Optional 4:  A7 lower
    Optional 5:  A8 upper
    Optional 6:  A8 lower
    Optional 7:  A9 upper
    Optional 8:  A9 lower
    Optional 9:  A10 lower