Cell phone BGA IC Adhesive Liquid solution remover BGA IC Epoxy Glue Remover

Price:   Starting at: $6.99

  • History: 11 Orders
  • Shipping Weight: 0.15kg
  • Units in Stock: 51
  • Model: VC572

Please Choose Right Price Option (Min-Max):

  • Option 1
  • Option 2 ( +$1.00 )
(complete orders today,deliverd around 30/11/2017 )
Professional-grade Repair Toolkits to Fix Your Phone
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    About 4-20 days.
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    Cell phone BGA IC Adhesive Liquid Remover is cleaning tool for iPhone BGA IC repair,it is used for softening and removing epoxy glue and black sealing glue on iphone BGA IC,the glue removing cleaning tool is very helpful to iphone BGA IC repair



    Cell phone BGA IC Adhesive Liquid solution remover BGA IC Epoxy Glue Remover


    [Optional Types]:

    Optional 1: capacity:20ml
    Optional 2: capacity:30ml
     

    The ingredients of it is environmental protection and safest. It has good permeability.It can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.It does not to harm to circuit board and component, even to maintenance worker.


    How to use :

    1. Use a tweezers to pick a piece of cotton wool with bigger size to BGA chip and Dip it into the glue remover.
    2. Put the cotton wool on the BGA chip and cover through
    3. Place a plastic bag or film on the top and cover the PCB board
    4. Wait for 20mins.
    5. REDO step 1 to 4
    6. Use a tweezers to remove softened sealing glue around the BGA
    7. Use Hot air gun (300Deg. C) to heat up the chip. The Glue at the bottom will melt and soften by heat
    8. Use a Tweezers / cutter to remove the chip

    Attention:
    glue removing liquid , it shall not touch skin, eye, close it after using. if touched by accident ,pls use water clean it 


    Package List:

    1 x bottle glue removing liquid