HZW 0.1mm iPhone A8 A9 A10 CPU BGA Reballing Stencil Template

Price:   Starting at: $2.99

  • History: 16 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 9962
  • Model: VC881

Please Choose Right Price Option (Min-Max):

  • Included ( +$16.00 ) (+0.12kg)
  • Without
  • A8 upper
  • A8 lower
  • A9 upper
  • A9 lower
  • A10 upper
  • A10 lower
  • Included ( +$15.00 ) (+0.05kg)
  • Without
(complete orders today,deliverd around 21/08/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    About 4-20 days.
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    HZW iPhone A8 A9 A10 Reballing Stencil Template is iPhone is universal iPhone reballing tool, 0.1mm reballing stencil is designed to fix iphone motherboard BGA chip. The BGA positioning Mold and tin planting tool is available for iPhone 6/6P/6S/6SP/7/7P, it will save both your time and effort to finish your iPhone BGA IC chip repair



    HZW 0.1mm iPhone A8 A9 A10 CPU BGA Reballing Stencil Template



    [Optional Type]

    Optional 1: A8 CPU upper
    Optional 2: A8 CPU lower
    Optional 3: A9 CPU upper
    Optional 4: A9 CPU lower
    Optional 5: A10 CPU upper
    Optional 6: A10 CPU lower




    Note : Optional Positioning Mould (Black)  Not univeral,  the model Black Positioning Mould is only available for  the unique  BGA Reballing Stencil

    0.1mm HZW BGA Reballing Stencil Template for iPhone A8 A9 A10 CPU, it is made by high quality steel, BGA Reballing Stencil  + Black Positioning Mold, it can be heated directely by the hot air gun,  easy and quickly for reballing iPhone A8 A9 A10 BGA IC

    1) Universal Repair Base(magnetic)

           

    2) BGA Reballing Stencil




    3) BGA Reballing Stencil  + Positioning Mold