HZW iPhone A8 A9 A10 Reballing Stencil Template for iPhone BGA Chip Repair

Price:   Starting at: $2.99

  • History: 10 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 9989
  • Model: VC881

Please Choose Right Price Option (Min-Max):

  • Included ( +$15.00 ) (+0.05kg)
  • Without
  • Included ( +$16.00 ) (+0.12kg)
  • Without
  • Option 1
  • Option 2
  • Option 3
  • Option 4
  • Option 5
(complete orders today,deliverd around 27/11/2017 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
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  • Email us
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    HZW iPhone A8 A9 A10 Reballing Stencil Template is iPhone is universal iPhone reballing tool, it is designed to fix iphone motherboard BGA chip. The BGA positioning Mold and tin planting tool is available for iPhone 6/6P/6S/6SP/7/7P, it will save both your time and effort to finish your iPhone BGA IC chip repair



    HZW iPhone A8 A9 A10 Reballing Stencil Template for iPhone BGA Chip Repair
     




    [Optional Type]

    Optional 1: A8 CPU upper
    Optional 2: A8 CPU lower
    Optional 3: A9 CPU upper
    Optional 4: A9 CPU lower
    Optional 5: A10 CPU lower


    Optional BGA Reballing Stencil Package( Suggest Choose):
    BGA Reballing Stencil  + Black Positioning Mold




    Note : Optional Positioning Mould (Black)  Not univeral,  the model Black Positioning Mould is only available for  the unique  BGA Reballing Stencil




    0.1mm HZW BGA Reballing Stencil Template for iPhone A8 A9 A10 CPU, it is made by high quality steel, BGA Reballing Stencil  + Black Positioning Mold, it can be heated directely by the hot air gun,  easy and quickly for reballing iPhone A8 A9 A10 BGA IC



           

        Universal Repair Baseplate (magnetic)


     

               BGA Reballing Stencil  + Positioning Mold



                       BGA Reballing Stencil Template