iPhone 7 7P A10 BGA Reballing Stencil Kit for iPhone Baseband CPU WIFI Tin Planting

Price:   $0.99

  • History: 9 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 9983
  • Model: VC574

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(complete orders today,deliverd around 19/11/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    • Details
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    iPhone 7 7P A10 BGA Reballing Stencil Kit is iPhone BGA IC repair tool, it is typically used for iPhone A10 BGA  chip reballing. The lower iPhone 7 7P reballing stencil is a good phone repair assistant for tin planting,it is available for iPhone 7 and iPhone 7 plus BGA reballing.



    iPhone 7 7P A10 BGA Reballing Stencil Kit for iPhone Baseband CPU WIFI Tin Planting


    [ Optional Types]

    Optional 1: K01 A10 CPU
    Optional 2: K02 Baseband CPU
    Optional 3: K03 WIFI
    Optional 4: K04 Big Power IC 
    Optional 5: K06 Small Power IC