iPhone A10 A9 A8 CPU BGA Reballing Stencils with Positioning Mold

Price:   Starting at: $4.99  $3.59-28%

  • History: 12 Orders
  • Shipping Weight: 0.009kg
  • Units in Stock: 9978
  • Model: VC832

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Please Choose Right Price Option (Min-Max):

  • Included ( +$8.63 ) (+0.12kg)
  • Without
  • A8 upper
  • A8 lower
  • A9 upper
  • A9 lower
  • A10 upper
  • A10 lower
  • Included ( +$5.04 ) (+0.06kg)
  • Without
(complete orders today,deliverd around 27/04/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    iPhone A10 A9 A8 CPU BGA Reballing Stencils  is universal iPhone reballing tool, it is designed to fix iphone motherboard BGA chip. This high quality iPhone BGA positioning Mould and reballing stencil template is available for iPhone 6/6p/6s/6splus/7/7plus.



    iPhone A10 A9 A8 CPU BGA Reballing Stencils with Positioning Mold

    [ Optional Types(with magnetic)]

    Option 1:  0.1mm A8 upper
    Option 2:  0.1mm A8 lower
    Option 3:  0.1mm A9 upper
    Option 4:  0.1mm A9 lower
    Option 5:  0.1mm A10 upper

     

    [ Optional BGA Reballing Stencil Package ]

    (suggest choose: BGA Reballing Stencil + Positioning Mold (Black), and just 1pcs Universal Base Mold (Green), easy for your working, and also save mone)



    BGA Reballing Stencil + Positioning Mold (Black)  + Universal Base Mold (Green)
     



    Universal Base Mold (Green) 
     

    Positioning Mold (Black)