iPhone A6 A7 A8 A9 A10 Font NAND CPU BGA Reballing Stencil

Price:   $1.99  $1.55-22%

  • History: 10 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 9960
  • Model: VC424

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Please Choose Right Price Option (Min-Max):

  • A6 Font + CPU
  • A7 Font + CPU
  • A8 Font + CPU
  • A9 Font + CPU
  • A10 CPU
(complete orders today,deliverd around 01/06/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
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    High Precision iPhone A6 A7 A8 A9 Font NAND CPU BGA Reballing Stencil is 0.1 mm tin plate iPhone chip repair tool. The iPhone repair reballing stencil is used for more convenient operation to solder on iPhone circuit board. The high quality steel reballing stencil is available  for iphone 5/5s/6/6p/6s/6sp Font NAND CPU BGA reballing repair.

    iPhone A6 A7 A8 A9 A10 Font NAND CPU BGA Reballing Stencil

    [Optional Types]

    Optional 1:  A6 Font + CPU
    Optional 2:  A7 Font + CPU
    Optional 3:  A8 Font + CPU
    Optional 4:  A9 Font + CPU
    Optional 5:  A10 CPU


    0.1mm thin, but the material is special, heating is not easy to deformation, more durable.
    Aerospace technology manufacturing
    Open hole position precision
    Square opening tin pulp is easy to fall off
    Hole wall smooth without residue
    Remove the IC solder ball can effectively release completely
    Reduce the repair rate to improve the quality of welding