iPhone X PCB Middle Layer Repair BGA Reballing Stencil Template

Price:   $4.99

  • History: 8 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 991
  • Model: FX110

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(complete orders today,deliverd around 25/06/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    About 4-20 days.
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    iPhone X Motherboard Middle Layer BGA Reballing Stencil is high quality iPhone X motherboard Middle layer module repair tool, iPhone X Reballing Stencil Template is used for assisting professionals to do iPhone X BGA reballing in the most convenient and safest way. The iPhone X motherboard is designed to be two pieces, as well as BGA chips. The difficulty of repairing is increased, and the time of maintenance testing is also tedious. The high quality stencil will offer the best solution.



    iPhone X PCB Middle Layer Repair BGA Reballing Stencil Template

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