MJ 3D BGA Reballing Stencil Template for iPhone A8 A9 A10 BGA IC Repair

Price:   $23.99  $13.99-42%

  • History: 10 Orders
  • Shipping Weight: 0.015kg
  • Units in Stock: 9982
  • Model: VC884

Please Choose Right Price Option (Min-Max):

  • Option 1
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  • Option 3
(complete orders today,deliverd around 27/11/2017 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    MJ 3D BGA Reballing Stencil Template is iPhone A8 A9 A10  BGA IC repair tool, it is used for planting tin on iPhone BGA. This BGA reballing tool is available for iPhone 6/6s/6 plus/6s plus,7/7plus. The 3D BGA reballing stencil is a good assistant for iPhone repair.



    MJ 3D BGA Reballing Stencil Template for iPhone A8 A9 A10  BGA IC Repair


    groove(Automatic Counterpoint) Reballing Stencil Template




    [Optional Types]:

    Optional 1:  MJ 3D A8
    Optional 2:  MJ 3D A9
    Optional 3:  MJ 3D A10
     



    MJ 3D A8:  iPhone 6/6 plus IC: Touch IC, Baseband,Font IC, Audio IC, Power IC, A8 CPU



    MJ 3D A9: iPhone 6s/6s plus: Touch IC, Baseband, Font IC, Audio IC, Power IC, A9 CPU


     

    MJ 3D A10: iPhone 7 /7plus: Touch IC, Baseband, Font IC, Audio IC, Power IC, A10 CPU