PPD A8 A9 A10 CPU BGA Reballing Stencil Mould for iphone BGA Chip Repair

Price:   Starting at: $22.99  $12.99-43%

  • History: 8 Orders
  • Shipping Weight: 0.15kg
  • Units in Stock: 992
  • Model: VC612

Please Choose Right Price Option (Min-Max):

  • A8 Full set ( +$14.13 )
  • A9 Full set ( +$14.69 )
  • A10 Full Set ( +$15.26 )
  • 4-6P NAND
  • 6S-7P NAND ( +$1.13 )
(complete orders today,deliverd around 28/07/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
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    PPD iPhone A8 A9 A10 NAND CPU BGA Reballing Stencil Mould is iPhone chip repair tool, reballing stencil is used for positioning and reballing CPU NAND chips, there are upper and lower parts for this reballing mould. The precision chip reballing stencil mould is available for iPhone 6 6P 6S 6SP, A8 A9 CPU tin planting.

    PPD iPhone A8 A9 A10 NAND CPU BGA Reballing Stencil Mould 

    [ Optional A8 A9 CPU Reball Stencil ]

    Option 1: A8 lower
    Option 2: A8 upper
    Option 3: A8 Full set 

    Option 4: A9 lower
    Option 5: A9 upper
    Option 6: A9 Full set 

    Option 7:  A10 lower
    Option 8:  A10 upper
    Option 9:  A10 Full Set 

    Option 10: iPhone NAND 4-6P 
    Option 11: iPhone NAND 6S-7P (PCIE)

    Brand New PPD BGA Reballing Stencil for iPhone 6S 6 Plus 6S 6S plus,  A7 A8 A9 A10 CPU Ram Upper Lower Reball Tool Stencils Planted tin Mold