VIPFIX iPhone A8 A9 A10 BGA Reballing Stencil Upper Lower CPU Repair

Price:   $3.99

  • History: 2 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 9995
  • Model: FX017

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Please Choose Right Price Option (Min-Max):

  • A8 upper +lower
  • A9 upper +lower
  • A10 upper +lower
(complete orders today,deliverd around 23/06/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    VIPFIX iPhone A8 A9 A10 BGA Reballing Stencil is ultrathin 0.12mm newly-design iPhone CPU BGA Reballing Stencil template, it is used for iPhone A8 A9 A10 CPU Upper Lower Layer reballiing repair. The high quality reballing stencil is designed with ventilation hole, it will supply the heat radiation function with many thermal via louver, and prevent bulges and avoid hump on the BGA Reballing Stencil Template.



    VIPFIX iPhone A8 A9 A10 BGA Reballing Stencil Upper Lower CPU Repair



    option 1: iPhone A8 Upper Lower Layer CPU BGA Reballing Stencil



    option 2: iPhone A9 Upper Lower Layer CPU BGA Reballing Stencil





    option 3:  iPhone A10 Upper Lower Layer CPU BGA Reballing Stencil