WL 0.1mm BGA Reballing Stencil for iPhone Baseband NAND A10 A9 A8 CPU

Price:   Starting at: $5.99  $4.99-17%

  • History: 26 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 9914
  • Model: VC728

Please Choose Right Price Option (Min-Max):

Positioning Mold
  • Included ( +$10.83 ) (+0.12kg)
  • Without
  • 5 / 5C /5S
  • 6 / 6P
  • 6S / 6SP
  • 7 / 7P
  • A8 upper
  • A8 lower
  • A9 upper
  • A9 lower
  • A10 upper
  • A10 lower
(complete orders today,deliverd around 20/08/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    WL 0.1mm BGA CPU reballing Solder template stencil is universal iPhone reballing tool, iPhone A8 A9 A10 reballing stencil is designed to fix iphone motherboard BGA chip. This high quality iPhone BGA reballing stencil template can work with positioning mould to allow more convenient repair, it is available for iPhone 6/6p/6s/6splus/7/7plus.

    WL 0.1mm BGA Reballing Stencil for iPhone Baseband NAND A10 A9 A8 CPU

    [ Optional BGA Reballing Stencil Package ]

    1) BGA Reballing Stencil  + Black Positioning Mold

    2) BGA Reballing Stencil  + Black Positioning Mold + Golden Base

    [Reballing Stencil Model Option]

    Option 1: iphone 5/5s Baseband and NAND
    Option 2: iphone 6/6p Baseband and NAND

    Option 3: iphone 6s/6sp Baseband and NAND
    Option 4: iphone 7/7p Baseband and NAND

    Option 5: A6 CPU upper (out of stock)
    Option 6: A7 CPU upper
    Option 7: A6/A7 CPU Lower

    Option 8: A8 CPU upper
    Option 9: A8 CPU lower

    Option 10: A9 CPU upper
    Option 11: A9 CPU lower

    Option 12: A10 CPU upper
    Option 13: A10 CPU lower

    [ Optional Aluminum Golden Base]

    it is universal, can fit with any black positioning mold

    1: Included base
    2: Without base

    [Optional Black Positioning Mold ]

    Not univeral, can't working with different BGA Reballing Stencil, the Black Positioning Mold just match with the right BGA Reballing Stencil.

    1: Included Positioning Mold
    2: Without Positioning Mold

    [ Package Picture ]

    BGA Reballing Stencil 

    BGA Reballing Stencil  + Black Positioning Mold

    BGA Reballing Stencil + Positioning Mold (Black)  + Universal Aluminum Mold Base (Golden)

    0.1-0.12mm thickness, high hardness, hardly deformed,  increase the success rate on BGA reballing Solder working, it is the  top quality BGA Reballing Stencil  for iphone Baseband CPU and NAND, A10 / A9 / A8 CPU..

    WL Top quality Fast Speed BGA reballing Solder template stencil

    Demo video: http://v.youku.com/v_show/id_XMTg5MDA1NDkyOA==.html