WL BGA Reballing Stencil Template for iPhone 5/5C/5S/6/6P/6S/6SP/7/7P BGA Chip Repair

Price:   Starting at: $15.99  $9.99-38%

  • History: 20 Orders
  • Shipping Weight: 0.01kg
  • Units in Stock: 9953
  • Model: VC855

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Positioning Mold
(complete orders today,deliverd around 25/02/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
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  • Email us
    vipfixphone@gmail.com
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    WL BGA Reballing Stencil Template is high quality iPhone BGA IC repair tool, it is designed to finish tin planting repair on iPhone BGA chip easily and quickly.  This reballing tool is available for iPhone 5/5c/5s/6/6plus/6s/7/7plus. It will offer great service to your iPhone BGA IC repair.



    WL BGA Reballing Stencil Template for iPhone 5/5C/5S/6/6P/6S/6SP/7/7P BGA Chip Repair


    WL high quality BGA Reballing Stencil Template for iPhone A7/A8/A9/A10  BGA Reballing Stencil template

          

     Positioning Mold + BGA Reballing Stencil template                                 BGA Reballing Stencil template


    [ Optional BGA Reballing Stencil Package ]

    Optional 1: iphone 5/5C/5S Baseband and NAND, A6 A7 CPU lower/upper
    Optional 2: iphone 6/6p Baseband and NAND, A8 CPU lower/upper
    Optional 3: iphone 6s/6sp Baseband and NAND, A9 CPU lower/upper
    Optional 4: iphone 7/7p Baseband and NAND, 7/7p WIFI,A10 CPU lower