17 in 1 Cell Phone BGA CPU Remove Repair tool Ultra thin Blade Set

Price:   $13.99

  • History: 14 Orders
  • Shipping Weight: 0.12kg
  • Units in Stock: 9961
  • Model: VC829

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(complete orders today,deliverd around 28/03/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    About 4-20 days.
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    The echanic Ultra Thin Blade Set is phone motherboard IC repair tool, it includes a metal handle and 10 different pricision blades that assist you in scraping, cleaning and cutting with defective mobile phone or tablet repair. All of the parts of this blade set are high quality and are individually verified for defects with strict standard.

    17 in 1 Cell Phone BGA CPU Remove Repair tool Ultra thin Blade Set

    Package list: 

    #0 T S016 handle
    #MCN-A Knifes,  remove phone IC, CPU Baseband 
    #MCN-B Knifes,  Shovel Glue ( Remove UV glue)
    #MCN-C,  Rubber Shovel UV Glue Knife
    #MCN-D,  separate rubber shovel Glue Knife
    #MCN-E,  Remove Glue on Marginal place
    #MCN-F,  Remove Glue on Marginal place (IC)
    #MCN-G,  Remove IC on motherboard
    #MCN-H,  Remove IC
    #MCN-I,  Remove 6S power IC

    Added: #MCN-J,  "J" Curved Blade ( Cutting Knife ), pry BGA CPU CHIP, Fast Remove A8 A9 A10 CPU 

                   "Z Y X W V T" 6 kinds Blade.

    Mechanic S1016 Plus BGA Repair Blade Set

    This Blade has a heat resistance, low templeratures, anti-oxidation, corrosion, resistance, abrasion resistance, toughness.

    Heat treatment specifications:

    780-820℃, Water-cooled. 

    Heat processing specification:

    Starting temperatures: 1000-1050℃, ending remperature 850℃

    Quenching specification:

    Quenching temperature: 730-760℃
    Quenching hardness 58HRC

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