Mechanic Phone mainboard BGA CPU Remove tool Ultra thin blade set

Price:   Starting at: $13.99  $11.55-17%

  • History: 10 Orders
  • Shipping Weight: 0.12kg
  • Units in Stock: 9966
  • Model: VC829

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(complete orders today,deliverd around 28/02/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    The echanic Ultra Thin Blade Set is phone motherboard IC repair tool, it includes a metal handle and 10 different pricision blades that assist you in scraping, cleaning and cutting with defective mobile phone or tablet repair. All of the parts of this blade set are high quality and are individually verified for defects with strict standard.

    Mechanic Ultra Thin Blade Set for Phone Motherboard IC Repair Tool

    Mechanic S1016 BGA Repair Ultra thin blade set used for remove IC Chip CPU BGA on Smart Phone mainboard, PCB Repair, operate convenient

    [Package list]

    Optional 1:

    #0 TS016 handle
    #MCN-A Knifes,  remove phone IC, CPU Baseband 
    #MCN-B Knifes,  Shovel Glue ( Remove UV glue)
    #MCN-C,  Rubber Shovel UV Glue Knife
    #MCN-D,  separate rubber shovel Glue Knife
    #MCN-E,  Remove Glue on Marginal place
    #MCN-F,  Remove Glue on Marginal place (IC)
    #MCN-G,  Remove IC on motherboard
    #MCN-H,  Remove IC
    #MCN-I,  Remove 6S power IC

    Optional 2: added: #MCN-J,  "J" Curved Blade ( Cutting Knife ), fast Remove A8 A9 A10 BGA CPU CHIP

    10pcs Blade + 1pcs Dual-purpose knife handle


    Mechanic S1016 BGA Repair Blade Set

    Blade Features:
    heat resistance, low templeratures, anti-oxidation, corrosion resistance, abrasion resistance, toughness.

    Heat treatment specification:
    Sample quenching: 780-820℃, Water-cooled. 

    Heat processing specification:
    Starting temperatures: 1000-1050℃,
    Ending temperature  : 850℃

    Quenching specification:
    Quenching temperature: 730-760℃
    Quenching hardness : 58HRC

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