Multi-function iPhone X BGA Reballing Motherboard Fix Cooling Platform

Price:   $49.99  $37.99-24%

  • History: 19 Orders
  • Shipping Weight: 0.3kg
  • Units in Stock: 981
  • Model: FX047

(complete orders today,deliverd around 28/02/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    Cooling logic board fixture is high quality multifunctional iPhone PCB repair platform tool, it is available for different sections for iPhone CPU NAND chips positioning, soldering, desoldering, reballing, etc. The high temperature resistant motherboard repair platform will offer the best assistance to professional cell phone fix!



    Multi-function iPhone X BGA Reballing Motherboard Fix Cooling Platform



    Features:


    1. The first PCB repair platform uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage,  pure copper heat conduction block does not directly contact the main board

    2. The first PCB repair platform added CPU positioning structure. No manual positioning needed, improve the success rate.

    3. The first PCB repair platform designed with integrated layer tin planting function. The precision stencils are produced by world's leading laser technology.

    4. The first PCB repair platform added motherboard layer separation and positioning installation structure.

    5. Designed with precision positioning column, it will makes efficient repairs for separating, soldering and installation.

    6. Pure copper heat conduction material are dealt with special process so that surface color will keep new.

    7.Apply imported synthetic stone materials, a number of testing and improved precision processing with 500 degree high temperature direct heating, durable and no deformation



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