WL Intelligent Grinding Equipment for iPhone IC CHIP Repair

Price:   Starting at: $3,999.99

  • History: 9 Orders
  • Shipping Weight: 70kg
  • Units in Stock: 987
  • Model: W001

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(complete orders today,deliverd around 30/11/2017 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    WL Intelligent Grinding Equipment is  professional iPhone IC chip repair machine, It is designed to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips in iPhone series mobile phone without any damage on the motherboard. The smart ic grinding machine for iPhone is very convenient to be controlled and operated with LCD touch screen instead of computer, it can offer great service in mobile phone repairing and refurbishing.



    WL Intelligent Grinding Equipment for iPhone IC CHIP Repair

     



    WL iphone IC Grinding Machine is perfect to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 6, 6 plus, 6S, 6S plus, 7, 7 plus. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing.
     

     

    Intelligent WL Grinding Machine Set Included:

    1× WL Grinding machine
    1× iPhone motherboard mould: 6, 6P, 6S, 6SP, 7, 7P
    1× Control box
    1× Power cable
    1× control line
    1× Parallel port cable 25pin
    1× Tool package
    1x water pump
    1x vacuum cleaner
    many pcs Milling cutting tool
    1x Full set second computer come with 17" monitor: pre-installed the professional controller software


    If use BGA rework station or desoldering station.

    1. BGA chip is difficult to be removed as soder ball melts but glue didn't.
    2. uneven heat will damage the surrounding chip and PCB layers, heat especially will melt surrounded BGA chip’s solder point and cause short circuit.


    If use IC grinding machine

    1. we can engraving the whole chip and show the PCB pads.
    2. PCB and chip may have tilt angle, it cause the engraving difficult to just cut a flat area, our smart IC remover has detector to check 4 corners of chip before engraving, we can then calculate the chip’s tilt angle.
    3. Work without PC, just control the LCD touch screen we can easy to remove BGA chip.
    4. No need to do glue removing.





    Note: Old Touch screen design, can't support iphone 6S 6S plus, 7 7 plus, stop produce!

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