QUICK 861DW Heat Gun Nozzle Sleeve For iPhone X Motherboard Desoldering

Price:   $9.99  $7.99-20%

  • History: 8 Orders
  • Shipping Weight: 0.1kg
  • Units in Stock: 992
  • Model: FX173

(complete orders today,deliverd around 24/08/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    QUICK 861DW Heat Gun Nozzle Sleeve is high quality phone repair tool, it is used for iPhone X Motherboard desoldering repairs, the Heat Gun Nozzle is available for QUICK 861DW / TR1300A Hot Air Rework Station, customized Heat Gun Nozzle is the best assistant for iPhone X folded-over logic board Desoldering.



    QUICK 861DW Heat Gun Nozzle Sleeve For iPhone X Motherboard Desoldering






    iPhone X logic board was folded in half, two layers then were soldered together, the upper layer is the mainboard, and the lower layer is the signal board. Which made our repair much difficult to proceed, how to repair iPhone X logic board in fast and efficient method, need the professional iPhone X motherboard repair tools