10CC PCB BGA Soldering Flux Paste for Phone Fix bga Reballing Paste Flux

Price:   $1.99  $1.59-20%

  • History: 22 Orders
  • Shipping Weight: 0.05kg
  • Units in Stock: 9836
  • Model: VC749

(complete orders today,deliverd around 21/11/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    10CC PCB BGA Soldering Flux is universal mobile phone repair tool that used for high-precision circuit board SMT soldering,  BGA welding process,  chips reballing etc.  This high quality paste flux is an essensial repair tool to make phone repair more convenient and easy.



    10CC PCB BGA Soldering Flux Paste for Phone Fix bga Reballing Paste Flux

    Features:


    The BGA Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips

    It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.

    ·Soldering paste for cell phone PCB and SMD etc.
    ·Help to repair the circuit boards and protect the electronic components
    ·A necessary material for repairing the mobile phone mainboard
    ·Flux Solder Paste
    ·no clean soldering
     
     

    Function:

    Phone repair
    PC BGA
    Electronics  Soldering