183℃ Solder Paste Phone BGA Soldering Cream Sn62.8/Pb36.8/Ag0.4

Price:   Starting at: $1.99

  • History: 6 Orders
  • Shipping Weight: 0.13kg
  • Units in Stock: 993
  • Model: FIX229

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  • Canned 55g ( +$0.30 )
  • Needle tube 42g
(complete orders today,deliverd around 21/11/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    183℃ Solder Paste is phone repair medium temperature Sn62.8/Pb36.8/Ag0.4 Lead Soldering tool, the 55g Phone PCB BGA solder paste solder flux melting point is 183℃, the high quality medium temperature solder paste will offer the best service for cell phone BGA soldering repairs.

    183℃ Solder Paste Phone BGA Soldering Cream Sn62.8/Pb36.8/Ag0.4 

    Two kinds of package:

    1: Syringe packaging: Needle tube 
    FIX-229 Sn62.8/Pb36.8/Ag0.4 42g

    2: Canned package:
    FIX-228 Sn62.8/Pb36.8/Ag0.4 55g


    Good conductivity
    Shining solder joints
    Good moisturizing
    Full solder joint
    Good tin drop performance

    1. With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.
    2. Wettability and demould properties are good, anti-cold & hot collapse and anti-dry are strong.
    3. Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection tombstoning displacement phenomenon.
    4. Full tin and shinning tin beads, less residue, white and transparent, and there is no strong corrosive substance such as fluorine.