Low Temperature Solder Paste 138℃ Sn42/Bi58 Lead Free 42g Phone Repair

Price:   $1.99

  • History: 4 Orders
  • Shipping Weight: 0.1kg
  • Units in Stock: 981
  • Model: FIX230

Please Choose Right Price Option (Min-Max):

  • Canned 42g
  • Needle tube 42g
(complete orders today,deliverd around 25/09/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
  • New Products
    23-Piece Fix Phone Opening Tools Repair Kit for iPhone iPad Samsung
    $3.50
    VIPFIX iPhone 6S / 6P 2.5mm Inner Hex Head Screwdriver Fix Phone PCB
    $0.99
    Rigol DP832 DP832A Professional DC Power Supply for Phone Repair
    $399.99  $379.99-5%
    VIPFIX iPhone 7 8 8 Plus Screwdriver Opening Tools Kit for Phone Fix
    $5.99  $5.55-7%
    • Details
    • Reviews
    • Tags
    • FAQ

    Low Temperature Solder Paste is high quality lead free 138℃ soldering tool for Apple Samsung Mobile Phone logic board BGA Repair: NAND Flash CPU Wifi BGA Soldering Repair, the 42g 138℃ Sn42/Bi58 Lead Free Solder Paste will be the best solution for cell phone PCB circuit board repair like BGA welding or BGA reballing.



    Low Temperature Solder Paste 138℃ Sn42/Bi58 Lead Free 42g Phone Repair

    138℃ Sn42/Bi58 Low Temperature Lead-free Solder Paste for Phone BGA Soldering Repair



    Two kinds of package:

    1. Needle tube packaging:
    FIX-230 Sn42/Bi58 42g

    2. Canned package:
    FIX-231 Sn42/Bi58 42g





    Lead free (lead is harmful to human body, when welding the motherboard, people will breathe in lead, which is toxic substances, not conducive to the health of the repairmen). Lead free is environmentally friendly. It contains no lead but silver, good conductivity and higher price.


    The melting point of low temperature is about 138℃, Solder joints turn off, Good temperature and moisture, Full solder joint



    Features:

    1. strong continuous printing performance, suitable for fine pitch IC and BGA and precision components welding.
    2. good wettability, good resistance to cold collapse, thermal collapse and strong dry resistance.
    3. suitable for PCB welding with various high requirement materials, fine pitch and high precision components.
    4. It is full and bright after the solder paste is applied on PCB, and the residue is less white and transparent, and no fluorine and other highly corrosive substances.

    Similar Products