MCN-3606 Black Glue for soldering repair iPhone A8 A9 CPU BGA Chip

Price:   $9.99

  • History: 19 Orders
  • Shipping Weight: 0.09kg
  • Units in Stock: 9924
  • Model: VC546

(complete orders today,deliverd around 19/08/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
  • New Products
    DCSD USB Cable 64Bit iPhone NAND Flash Test Fixture Engineering cable
    $29.99  $15.99-47%
    YIHUA 968DB+ Multipurpose Soldering Rework Station for Fix Mobile Phone
    YIHUA 1000A 1000B 3 in 1 Infrared BGA Rework Station for Fix Phone
    YIHUA 628TD 8x Magnifying Glass Soldering Rework Station Fix Phone
    $29.00  $26.99-7%
    • Details
    • Reviews
    • Tags
    • FAQ

    MCN-3606 Black Glue is iPhone motherboard BGA chip fix tool, it is used for soldering iPhone A8 A9 CPU BGA chip. The phone black soldering glue is essential when changing iPhone IC, repairing iPhone motherboard, replacing iPhone IC, NAND Flash, etc. It will make your phone motherboard maintenance more convenient.

    MCN-3606 Black Glue for soldering repair iPhone A8 A9 CPU BGA Chip

    heating curing 120°C   20-40m / 180°C  3-5m, heat gun curing 120°C


    iPhone 5s 6 6p 6s 6sp 7 7p motherboard special Black Glue,  change IC, repair iphone motherboard, replace iPhone IC, NAND Flash, capacitive resistance (FPC connector Socket ), CPU, WIFI, for UV Solder Mask Solder Resist.