MECHANIC BGA Solder Paste Flux Paste for Phone Motherboard Soldering

Price:   Starting at: $2.99  $2.59-13%

  • History: 22 Orders
  • Shipping Weight: 0.02kg
  • Units in Stock: 9895
  • Model: VC505

Please Choose Right Price Option (Min-Max):

  • MCN-UV50 (50g)
  • MCN-UV80 (80g) ( +$0.87 ) (+0.01kg)
(complete orders today,deliverd around 29/10/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
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    The MECHANIC BGA Solder Paste is good quality mobile phone repair tool, cell phone repair solder paste is used for high-precision phone circuit board SMT soldering, BGA welding process, etc. The phone paste flux has 50g and 80g two different weight that offer you very convenient operation for mobile phone PCB repair.

    MECHANIC BGA Solder Paste Flux Paste for Phone Motherboard Soldering

    [ Optional Model]

    Option 1:  MCN-UV50
    Option 2:  MCN-UV80

    Packing:  aluminum box
    Application: PCB, BGA, SMD, PGA repair


    - MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair, Electric - Soldering Iron Welding Fluxes for phone circuit board repair
    - High bond strength, PH value neutral, insulation is strong, welding surface smooth IC and PCB for no corrosive
    - Its boiling point only slightly higher than the melting point of the solder
    - For mobile phones, PC cards and other sophisticated electronic chip-level help welding