VIPFIX Lead Free Solder Paste High Medium Low Temperature Phone Fix

Price:   Starting at: $4.00  $2.99-25%

  • History: 26 Orders
  • Shipping Weight: 0.1kg
  • Units in Stock: 9964
  • Model: FX028

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Please Choose Right Price Option (Min-Max):

  • high temperature ( +$0.90 )
  • middle temperature
  • low temperature ( +$0.30 )
(complete orders today,deliverd around 21/11/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    VIPFIX solder paste is high quality phone fix tool, cell phone repair solder paste is used for assisting the cell phone PCB soldering repairs like BGA reballing, PCB pad welding operation. The precision solder paste will be available for different temperature cell phone PCB solder repair: High temperature, medium temperature and low temperature. 

    VIPFIX Lead Free Solder Paste High Medium Low Temperature Phone Fix 

    Temperature Option:

    Option 1: high temperature: 260 ℃- 32.6g
    Option 2: medium temperature: 183℃ Sn62.8/Pb36.8/Ag0.4 -  50.0g
    Option 3: low temperature: 138℃ Sn42/Bi68 Lead-Free - 50.0g


    Less Residual
    No need to clean
    Precision and smooth welding


    Brand: PHONEFIX
    Warranty: 1 year
    Product model:
    Melting point: Low Temperature 138℃ and Medium Temperature 183℃
    Main purpose: PCB Pad Welding
    Material: Lead Free / Lead 
    Storage environment: room temperature / cold storage


    1. With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.
    2. Wettability and demould properties are good, anti-cold&hot collapse and anti-dry are strong.
    3. Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection tombstoning displacement phenomenon.
    4. Full tin and shinning tin beads, less residue, white and transparent, and there is no strong corrosive substance such as fluorine.

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