QUICK 7610 Cell Phone BGA Rework Station BGA Repairing Machine

Price:   $1,699.00

  • History: 9 Orders
  • Shipping Weight: 45kg
  • Units in Stock: 989
  • Model: VIP341

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(complete orders today,deliverd around 29/10/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
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    About 4-20 days.
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    QUICK 7610 Cell Phone BGA Rework Station is high quality mobile phone BGA repairing machine that used for preheating, welding, repairing BGA / CSP and other SMT surface mount components with a dedicated software to control the entire process and record all of its information, QUICK 7610 BGA rework system with infrared preheating light is one of the most valuable electronic tools electronics industry.

    QUICK 7610 Cell Phone BGA Rework Station BGA Repairing Machine

    BGA QUICK 7610 precise non-contact infrared temperature sensors to control surface temperature, temperature control accurate, sensitive, and in order to achieve a more rigorous process window requirements for lead-free soldering; their top and bottom are dark red outer heating medium wavelength heating, a uniform heat distribution, to thereby obtain the best control of the welding process and non-destructive, can be repeated production of PCB temperature; adjustable aperture, of the infrared heater below the adjacent parts can be protected on the PCB on the heating of the temperature-sensitive element, while You do not need to rework nozzle.

    Specification for QUICK 7610 BGA rework station:

    1.Total power: 2400W (max)
    2.Bottom preheating power: 1600W (infrared ceramic heating plate)
    3.Top heating power: 720W (infrared heating tube, wavelength about 2 to 8μm, size: 60 * 60mm)
    4.Bottom radiation preheating size: 260 * 260mm
    5.Maximum PCB size: 420mm * 500mm
    6 Max BGA size: 60 * 60mm
    Newsletter: standard RS-232C (online) and PC / USB interface optional
    8 infrared temperature sensor: 0 ~ 300 °C (temperature range)
    9.Dimensions: 785 * 532 * 518mm

    Features for QUICK 7610 BGA rework station:

    1 using the heated the opening formula infared outside for the closed loop control by the BGA surface of the non-contact infrared sensor senses the temperature change, and ensure accurate temperature process window, uniform heat distribution.
    2 using a large area at the bottom of infrared heating, prevent PCB deformation, warping.