QUICK 857DW ESD Hot Air Gun SMD Soldering Station Fix Phone

Price:   Starting at: $69.99  $59.99-14%

  • History: 11 Orders
  • Shipping Weight: 3.6kg
  • Units in Stock: 9985
  • Model: VC400

Please Choose Right Price Option (Min-Max):

  • 110V ( +$12.86 )
  • 220V
(complete orders today,deliverd around 19/11/2018 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
  • New Products
    0.01mm 0.02mm Insulated Jumper Wire Fix Phone Motherboard
    $1.55  $0.99-36%
    iSocket iPhone X Upper Lower Layers Motherboard Test Fixture
    $279.99  $223.99-20%
    Bakon BK950D 110V 220V 50W Soldering Iron with Digital Display
    $25.55
    5V Microscope LED USB 60pcs Circle Light For Phone Motherboard Repair
    $15.55  $12.99-16%
    • Details
    • Reviews
    • Tags
    • FAQ

    QUICK 857DW ESD Hot Air Gun SMD Soldering Station is mobile phone PCB chips repair machine that blows hot air for removing and soldering electronic components of a mobile phone.This heat gun blower SMD soldering station with 4 air nozzles replacement can work with adjustable temperatrue by its digital control button and LED digital display.



    QUICK 857DW ESD Hot Air Gun SMD Soldering Station for Fix Phone


    Technical parameters:

    Power Consumption:580W
    Air pump:DC motor,double turbine rotate out of the wind
    Temperature control:100 to 450 degrees
    Gas flow rate:100 litres/minute
    Component length:110cm
    Size:17 x 10.5 x 24 cm

     
    Product features:

    1, linear air volume adjustment, mains have change the air volume can be stable, double vortex spinning wind, the wind is soft, no impact.
    2, express of temperature, 3 seconds to reach the set temperature, temperature of liquid crystal display (LCD), intelligent sensor, automatic cooling, delay shutdown.
    3, welding with plastic components, ringer, such as the tail inserted inline deformation, welding circuit board no bubbles. Shield does not change color
    4, BGA chip is not easy to break.
    Product use:
    1, suitable for a variety of components desoldering. Such as: SOIC, CHIP, QFP, PLCC, BGA, etc.
    2, used in thermal shrinkage, drying, in addition to the paint, in addition to stick, thawing, preheating, disinfection, plastic welding, etc.

    Package List: 
     

    1 x heat gun Quick 857DW
    2 x tweezers

    Similar Products