YIHUA 1000A 1000B 3 in 1 Infrared BGA Rework Station for Fix Phone

Price:   Starting at: $355.00

  • History: 8 Orders
  • Shipping Weight: 14kg
  • Units in Stock: 9985
  • Model: VC183

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(complete orders today,deliverd around 29/11/2017 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    YIHUA 1000A / 1000B 3 in 1 Infrared BGA Rework Station is multipurpose mobile phone repair instrument that includes SMD hot air gun,540W preheating station and 75W soldering iron,which can be used for desoldering, preheating, repairing all components, especially Micro BGA components.This professional phone rework station can be easily operated with regulated controls and LCD display.



    YIHUA 1000A 1000B 3 in 1 Infrared BGA Rework Station for Fix Phone


    YIHUA 1000B Soldering rework station: powerful electronics repairing machine for all kinds motherboard / repair, YIHUA 1000B 3-IN-1 Infrared BGA Rework Station for Personal Repair Shop: motherboard / laptop / mobile phone motherboard repair.

    Model Option:

    1: YIHUA 1000A: 3-IN-1 -   infrared lamp + BGA reball heater Preheating Station + Soldering Station platform

     

    2: YIHUA 1000B: 4-IN-1 -   infrared lamp + BGA reball heater Preheating Station + Soldering Station platform + hot air gun


    Feature:


    1. Using the new SAMSUNG microcomputer processor PID programmable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.
    2. Adopt infrared weld technology which independent exploration , infrared penetration strength , components uniform heating , beyond the traditional hot air heating vowed to prevent blow off the IC surrounding small components.
    3. Technician focused infrared heat is easy to target most component removal/replacement and re-work.
    4. Infrared heat source bulbs are long-lived , un-expensive and easily replaced.
    5. Has bright delicate , low voltage LED lighting , safety and energy conservation.
    6.It has External Sensor Temperature control mode , that is detected by the sensor IC surface temperature control temperature , this function is good for freshman operation , it’s safe way protect  components .
    7.MountTechnology (SMT) components 15-35cm in size.
    8. This machine has 540W heating system , widely to 120mm*120mm.
    9. Preheating plate color is black , from the photics point of view , black color easy to absorb heating , shorten the warm-up time.
    10. Powerful human function design , with the following functions
    A. Temperature correction function  Correction of temperature range -50°C~+50 °C ( Infrared lamp analog value 580 ).
    B. Celsius / Fahrenheit temperature display function
    11. This machine also has soldering iron function , if you have the device , you can used for all of the components solder , desoldering , preheating , repair all components , especially Micro BGA components.  
     
    Technical Data
     
    Voltage  AC220V±10%
    Max power consumption 715W
     
    Preheating station parts
     
    Max power consumption 540W
    Light-emitting components Far infrared heating plate
    Temperature Range 50°C-200°C
    Display Type LED
    Preheating area 120*120mm
     
    Infrared lamp parts
     
    Max power consumption 150W
    Light-emitting components Infrared emission lamp
    Temperature Range 100°C-350°C / 212°F~662°F
    Temperature Stability ±1°C
    Display Type LED
    Effective irradiation area 35*35mm
    Come with 2 lens cup , you can be choice two of  lens cup from  28mm / 38mm / 48mm.
     
    Soldering station parts
     
    Max power consumption 75W
    Heating components imported heater
    Temperature Range 200°C-480°C / 392°F~896°F
    Temperature Stability ±1°C ( statics )
    Tip of ground voltage <2mV
    Tip ground impedance <2 ohm
    Display Type LED Display
    Handle cable length ≥100cm
     

    NOTE: Operation infrared BGA rework station
     

    1.Repair circuit boards required precautions and necessary protective measures

    1)To ensure that both sides of the circuit board preheat zone without fusible explosive flammable components , like Plastic , Display , Phone camera , LED , Electrolytic capacitors.

    2)Ensure that no combustible fusible explosive components in Infrared light can shine on the area , If you can not avoid , Must use reflective paper keep out that. like Plastic , Display , Phone camera , LED , Electrolytic capacitors.


    2.According to IC size , use a suitable diameter lamp cup ( lamp cup size larger than IC size ) ; Install lights Cup minimize the distance between lamp and IC , to facilitates heating.


    3. Ensure that the working environment is no greater airflow to prevent heat loss , well sheltered measures when necessary.


    4. Apply solder paste to the IC before the desoldering , also you can early preheat then Apply solder paste , Especially BGA package IC , should be early preheat then apply solder paste , the can make solder paste penetrate into the bottom of the IC.


    5. Wear heat protective gloves and goggles. Place the visor , good shading measures to protect the eyes.


    6. Turn on the Infrared light power , set the temperature to about 280°C . Make the appropriate adjustments based on the size of the IC and circuit board . IC by infrared light irradiation will be rapidly warming ( generally 1 to 3 minutes ) .


    7. Just started using this product , it is best to try to use the abandoned circuit board rework a few times. and so familiar with the use of this product , then carry out normal maintenance work.



    540w IC Bga Rework Station , Infrared Soldering Station Repairing Circuit Boards Usage

    1). Suitable for de-soldering and soldering BGA , SOIC , CHIP , QFP, PLCC package SMD IC,

    Particularly suitable for desoldering BGA module , computer motherboard north and south bridge,

    all kinds of mobile phone motherboard SMT IC and LED lights.


    2). Shrinking , Paint drying , adhesive removal , thawing, warming , Plastic welding etc.
     

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