SP-360C IR BGA Rework Station Touch Screen Soldering Rework Machine

Price:   $1,555.00

  • History: 9 Orders
  • Shipping Weight: 55kg
  • Units in Stock: 9990
  • Model: VC185

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(complete orders today,deliverd around 29/11/2017 )
Professional-grade Repair Toolkits to Fix Your Phone
  • Delivery Time
    About 4-20 days.
  • Shipping Method
    DHL,UPS,EMS,FEDEX,HKPost..
  • Payment
    Paypal, WU, MoneyGram, TT..
  • Email us
    vipfixphone@gmail.com
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    SP-360C IR BGA Rework Station is precision mobile phone BGA repair instrument,it is designed to solder and desolder small components on PCB.And also offers adjustable PCB positioning supports to install PCB easily and quickly .This professional IR BGA rework station with touch screen interface and PLC control can be a perfect service for your repairing job.



    SP-360C IR BGA Rework Station Touch Screen Soldering Rework Machine
     

    Feature:

    High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.
    Movable heating head, able to move horizontally; easy to operate

    Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2 high definition screen, convenient for operation and observation

    Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input
     
    The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA

    The BGA soldering supporting frame can micro-adjusted to avoid local sinkage

    Powerful cross flow can cool the lower heating area

    The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards
     with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA

    Set with over temperature alarming and protection function
     
    Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs

    The integrated design of machine and chassis is room-saving.



    Specification:

    Applicable PCB size
    Max PCB size: 430mmX350mm
    Applicable BGA size
    Max size: 55mmX55mm
    Min size: 7mmX7mm
    Max weight: 80g
    Power for operation: 3600W
    Main heater: 800W
    Lower heater: 800W
    Bottom heater: 2400W



    Machine dimension: 650*500*600mm
    Input power: AC 220V 3.6KW



     
    Package List:

    Shuttle Star SP-360C BGA rework station


    Accessories :

    Nozzles 5 pcs (44, 41, 38, 31, 26 mm,  1pc for each size)
    Tools box
    Inside the hexangular wrench
    Clamp for Motherbord
    Brush1
    USB mouse
    Vacumm IC pikcer
    Aluminium plate for BGA IC reballing
    Thermo sensor wire(High precision)
    Reballing stencils holder
    Reballing stencils
    English manual 1 book
     

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