How Do You Use Hot Air Gun For Phone Repairs

Before learning mobile phone repair, we should first learn the necessary tools and how to use them. Speaking of mobile phone motherboard repair, you must know some common repair tools like microscope, solder iron… In this guide, VIP FIX Shop Team will teach you the feature and function of one of the most essential tools required – Hot air gun.

There are two kinds of hot air guns that we usually use for phone repairs, one is the cyclone air gun, and the other is the straight air gun. And you can also choose different hot air gun nozzles for different repair demands.

For the straight air gun, we take the Quick 801 hot air station as an example. The straight air gun generally uses relatively small nozzles, and the heat is relatively concentrated so that the possibility of damage to the side components will be reduced. It is generally used for the disassembly and assembly of relatively small chips or components, chip solder reball and so on. 90% of the components on a mobile phone motherboard are small, so the frequency of use of the straight air gun is very wide.

When using a straight air gun, the wind force is usually set at 30. There are generally three regular settings for temperature, the first temperature we can set to 370 degrees, which is generally used in the field of tin or chip removal. The second setting is a temperature of 450 degrees, which is often used for disassembly and assembly of normal temperature chips and components. The third setting is generally adjusted to 500 degrees, which is often suitable for experienced mobile phone repairers, because the heat dissipation is faster and very easy to damage other components.

For cyclone air gun, we will explain by taking Quick 2008 hot air station as an example. Generally, medium-caliber air nozzles are used for a cyclone air gun. The cyclone air gun is characterized by spiral wind, and the heated area is relatively scattered. Also, the wind is relatively soft so it is not easy to damage the chip on motherboard. It is generally used for disassembly and assembly of relatively large chips.

Let’s take Apple’s WiFi chip as an example. If the chip size is bigger than or equal to the WiFi chip, we can use a cyclone hot air gun. If the chip size is less than or equal to the WiFi chip, we can use a straight air gun. And we can use either of them for any chip as big as WiFi, frequently cyclone air gun is used for chip repairs like NAND, CPU and so on.

When using a cyclone hot air gun, our default wind force is generally 100. We can select and set the commonly used temperature with the buttons on hot air station, so that it will be much more convenient when we use it next time. The temperature of 295 degrees is often suitable for the installation of chips, card slots, tail plugs and other mobile phone accessories. The temperature of 355 degrees is often suitable for disassembling conventional chips, such as CPU, NAND, etc. The temperature of 375 degrees is generally applied to motherboards that require faster heat dissipation, such as iPad motherboard.

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