2UUL Universal Magnetic Platform Phone Motherboard Mid Frame CPU Nand Chip Reballing Base Holder. MaAnt C2 Magnetic Universal Platform For Motherboard BGA Chip Soldering Repair. MaAnt C2 Double-sided Magnetic Soldering Reballing Platform. 2UUL Universal Silicone Phone Board Mid Frame Reballing Magnetic Platform motherboard middle frame positioning tin planting platform for Phone motherboard middle layer soldering repair.
Option:
1. 2UUL Universal Magnetic Platform.
2. MaAnt C2 Magnetic Universal Platform.
MaAnt C2 Features:
1. Non-extreme magnetic universal platform, easy chip tinning, high-intensity magnetic design, grip firmly and accurately.
2. Positioning cassette built-in strong magnetic, and the base strong magnetic adsorption, flexible movement, position clamping fixed chip, clamping flexible, stable, suitable for 99% Android mobile phone chip clamping tin.
3. High-temperature resistant synthetic stone, synthetic stone design, green stone, high-temperature resistance toughness fouling easy to clean
4. The front is able to work and plant tin, can be put and can be used, and the planting tin range is wide.
5. Flexible fixed motherboard, chip, can adjust the position, suitable for 99% Android motherboard, chip fixed tin, can be used
6. Size: 98mm*78mm*8mm.
2UUL Universal Magnetic Platform Features:1. 2UUL Universal Phone Board Mid Frame Reballing Magnetic Platform.
2. Strong magnetic automatic positioning: Built-in strong magnetic adsorption.
3. High precision and precise alignment: The stencil and pad tightly, make solder paste scraping and tin planting easier.
4. Remove the stencil and plant the tin, the tin ball is full and uniform: Effectively prevent stencil from bulging make the service life longer.
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