2nd Generation Enhanced Version
New technology of Repair Welding
Fixed pin of pad : the pads are reinforced with fixed pins and will never fall off.
Ultra-thin experience: it adopts industrial-grade printed circuit board copper foil with a thickness of 30um
Strong bond: The connection joint with the circuit is firm,and can fixed the green oil well.(UV curing solder mask ink)
Good flatness: good flatness,which can prevent pseudo soldering effectively caused by unevenness.
Save time and energy: it saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high.
Stable welding: The BGA bonding surface has high saturation,stable eledtrical performance,good welding strength,and it is not easy to drop off and unsoldering.
Applicable for dot-faded soldering pad with various shapes and models of soldering lug
Applicable for beauty the pad with seamless repairing
Effect After Repairing
Curling the wires to make jumper wires is no longer needed. After pads soldering, the double-layered motherboard can be installed to the testing fixture or recombined directly. Repair efficiency will be tremendously increased.