WDS-700 BGA desoldering Rework Station for circuit boards repair


Price:
$2,699

Description

Optical alignment system BGA rework station WDS-700

WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework.

How to separate BGA chip from motherboard / How to replace a new BGA chip

Repair steps

1: Separate the BGA chip from mother board -we called desoldering
2: Clean Pad
3: Reballing or replace a new BGA chip directly
4: lignment/Positioning -Depend on experience ,silk frame ,optical camera
5: replace a new BGA chip - we called Soldering

user manaul and technical parameters:

https://drive.google.com/file/d/1YPxRbdjkTAQIHVKoBLdJozCTU79koMJy/view?usp=sharing

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