Samsung MTK CPU BGA Reballing Stencil Template For Huawei MTK LG Xiaomi Android Mobile Phone Motherboard Soldering Repair
[ Optional Types ] :
- Option 1: A95 MTK
- Option 2: G1025 MTK Xiaomi
- Option 3: huawei opp xiaomi series
- Option 4: A96 iPad
- Option 5: MSM8917 Samsung Huawei
- Option 6: MSM8992 LG
- Option 7: MSM8996 Huawei
- Option 8: G1037 MTK Xiaomi
- Option 9: MT8392V Samsung MTK Huawei
- Option 10: A97 MTK
- Option 11: A467 MTK Huawei
- Option 12: PMB9933 Samsung
Product Features :
- 100% new brand and high quality direct heating BGA rework reballing stencil set
- For Samsung MTK Xiaomi Huawei Oppo Vivo LG
- Super thin thickness, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Color: As Pictures Show
- Type: Universal BGA Reballing Template
- Design: Heat Dissipating Holes Design
- Unit Type: Piece
- Suitable for: for General Rework Station
- Function: for Phone BGA Reballing
Package includes :
- 1pcs x BGA Reballing Stencil
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