MTK BGA Reballing Stencils Template Net For Samsung Huawei Xiaomi

Option: A95 MTK


MTK CPU BGA reballing stencils net steel template for Android Samsung Huawei Xiaomi mobile phone soldering steel net, MTK BGA reballing reball stencils kit for PMB9933 MSM8917 MSM8992 MSM8996 MT8392V G1025 G1037 A96 A97 A467 steel mesh, BGA reballing stencils repair assistant for cell phone rework, it is used for professional reballing operation on Samsung Huawei LG MTK Xiaomi Oppo Vivo BGA IC chips.

Samsung MTK CPU BGA Reballing Stencil Template For Huawei MTK LG Xiaomi Android Mobile Phone Motherboard Soldering Repair

[ Optional Types ] :
  • Option 1: A95 MTK
  • Option 2: G1025 MTK Xiaomi
  • Option 3: huawei opp xiaomi series
  • Option 4: A96 iPad
  • Option 5: MSM8917 Samsung Huawei
  • Option 6: MSM8992 LG
  • Option 7: MSM8996 Huawei
  • Option 8: G1037 MTK Xiaomi
  • Option 9: MT8392V Samsung MTK Huawei
  • Option 10: A97 MTK
  • Option 11: A467 MTK Huawei
  • Option 12: PMB9933 Samsung

Product Features :

  1. 100% new brand and high quality direct heating BGA rework reballing stencil set
  2. For Samsung MTK Xiaomi Huawei Oppo Vivo LG
  3. Super thin thickness, easy to use.
  4. Special designed: Heat dissipating holes design.
  5. High quality steel material, can work great with any universal phone repair BGA rework station.
  6. Offer the best BGA repair solution for phone heating repair.

Product Specifications :

  • Item name: BGA Reballing Stencil Template
  • 100%: High quality
  • Color: As Pictures Show
  • Type: Universal BGA Reballing Template
  • Design: Heat Dissipating Holes Design
  • Unit Type: Piece
  • Suitable for: for General Rework Station
  • Function: for Phone BGA Reballing

Package includes :

  • 1pcs x BGA Reballing Stencil

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