WL BGA Reballing Stencils For iPhone Baseband NAND A10 A9 A8 CPU


Option: A6/A7 CPU Lower
Base: Without Base
Price:
$5.45

Description

WL 0.1mm BGA reballing stencils kit for iPhone Baseband NAND A10 A9 A8 upper lower CPU soldering repair, BGA reballing stencil template come with black positioning mold, WL high quality soldering BGA reballing stencil with fixed plate, WL high accuracy solder Jig template ball solder stainless steel net for iPhone Baseband NAND chip, A6 A7 A8 A9 A10 A11 A12 A13 CPU BGA reballing stencils template

WL 0.1mm BGA Reballing Stencils Kit with Black Positioning Mold For iPhone A6 A7 A8 A9 A10 A11 A12 A13 CPU Baseband NAND Soldering Repair Tool

[ Optional Types ] :
  • Option 1: A6 CPU Upper - out of stock
  • Option 2: A6 / A7 CPU Lower
  • Option 3: A7 CPU Upper
  • Option 4: A8 CPU Upper
  • Option 5: A8 CPU Lower
  • Option 6: A9 CPU Upper
  • Option 7: A9 CPU Lower
  • Option 8: A10 CPU Upper
  • Option 9: A10 CPU Lower
  • Option 10: A11 CPU Lower
  • Option 11: A12 CPU Lower
  • Option 12: A13 CPU Lower


There are 3 sections of parts, BGA Reballing Stencil + Mold Positioning (Black) + Aluminum Universal Mold Base (Gold)

with fixed plate ( black positioning mold ), easy to use and more accurate CPU IC welding position

[ Optional aluminum mold base ] : It is universal, can fit with any black positioning mold

[ Optional Positioning Mold (Black) ] : Not universal, cannot work with different BGA Reballing Stencil, you need the right BGA Reballing Stencil model, the black positioning mold only match the right BGA Reballing Stencil.

 

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