Soder-Wick SW18045 offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. A full range of sizes and flux types are available, including
Rosin, No Clean, unfluxed and a high temperature Lead-Free version. Whatever the requirement, Soder-Wick has the answer.
Features :Requires little or no post solder cleaning
No corrosive residues
Optimized construction for faster wicking and heat transfer
Halide free
Minimizes the risk of heat damage to components and circuit boards
TYPICAL APPLICATIONS: Soder-Wick SW18045 desoldering braid safely removes solder from:
- Thru-hole Components
- SMT Pads and BGA Pads
- Micro Circuits
- Terminals
- Lugs and Posts
- Identification Script
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