MECHANIC AD-233 AD-559 Lead-Free Halogen Free Welding Flux BGA Solder Ball Repair Solder Auxiliary Soldering Paste For Phone PCB PGA SMD Rework
Features:
Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals.
U.S. AM-TECH developed two ways to use the phone PCB, BGA and PGA SMD Rework help paste, which is used in low ionic activator system, run tin speed, low level of smoke residue after curing of the surface insulation resistance value is very high, so very small electrical interference for mobile phones and other communication products.
MECHANIC AD-233 AD-559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.
Specification:
Material: Plastic+Solder paste
Package:
1 x 100G/ 10CC Flux Paste
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