250g SANKI Rosin Soldering Wire Roll Lead Wire for Phone Motherboard

Size: 0.3mm


250g SANKI low temperature soldering wire roll for phone BGA PCB welding repair tool, 0.3/0.4/0.5/0.6/0.8/1.0/1.2/1.5mm low melting point rosin core flux solder wire for electric motherboard repair tool, high pure no-clean rosin roll core solder wire tin flux solder welding iron reel, 250g rosin soldering wire roll for circuit board, electronics devices and others repair.

SANKI 250g High Pure No-clean Flux Solder Tin Wire Thread Soldering Wire : 0.3/0.5/0.6mm/0.8mm/1.0mm

[ Option Type Soldering Wires Reel ] :

Option 1: 0.3mm (250g)
Option 2: 0.5mm (250g)
Option 3: 0.6mm (250g)
Option 4: 0.8mm (250g)

Diameter size: 0.3mm /0.5mm /0.6mm /0.8mm

Phone Repair Solder wire is available in different diameters such 0.3/0.4/0.5/0.6mm/0.8mm/1.0mm etc. For mobile phone repairing 0.5mm solder wire is best suitable.

Solder wire is used to solder Phone circuit board electronic components, IC or jumper, Features with anti-oxidation stability and anti-corrosion ability, it has excellent performance in desoldering, It is widely used in electrical and electronics, solder parts like circuit board, electronics devices and others

Package includes:
1pcs x Rosin Solder Wire

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