3D BGA Planting Stencils Kit For iPhone X Middle Layer CPU Repair


Price:
$9.45

Description

PCK 3D BGA reballing stencil template for iPhone CPU motherboard soldering repair tools, new style 3D BGA planting stencils kit for iPhone X middle layer motherboard BGA soldering repair mesh, 3D positioning and reballing iPhone X upper / lower layers motherboard welding repair, stepped groove middle layer BGA reballing stencil template for iPhone X PCB CPU soldering steel net

3D BGA Reballing Stencil Template For iPhone X Middle Layer Motherboard Soldering Repair Tool : Stepped groove / easy to use / accuratea lignment

Product Features :
  1. 100% new brand and high quality
  2. High quality tin reballing steel mesh
  3. Special design: Ultra-thin steel net, easy to use
  4. BGA reballing stencil template for iPhone CPU motherboard soldering repair
  5. Inspiration comes from the actual experience of mobile phone repair engineer, make a good repair tool belonging to mobile phone repair master

Product Specification :
  • Type: BGA Reballing Stencil
  • Material: Steel Sheet
  • Color: Silver
  • 100%: High quality

Package included :
  • 1pcs x BGA Rebaling Stencil Template

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