MJ 3D BGA Reballing Stencils Template Steel Net with Stepped Groove For iPhone A10 XS XR XS MAX CPU Motherboard Soldering Repair
[ Optional Molds ] :
- Option 1: MJ 3D A12 for iPhone XS / XR
- Option 2: MJ 3D A12 for iPhone XS MAX
Product Features :
- Stepped groove design enables stencil to align with tinning position of IC rapidly.
- The square holes design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter you are a new or expert.
- High success rate of planting tin, the solder balls can be formed once after you are proficient.
- This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.
MJ 3D A12: iPhone X XS MAX XR motherboard repair: NAND Flash, Touch IC, Baseband, Font IC, Audio IC, Power IC, A12 CPU
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