50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm

Size: 0.3mm


High purity rosin core solder wire for mobile phone electronic components welding repair, 50g 0.3/0.5/0.8/1.0mm rosin soldering wire for phone BGA motherboard repair, No-cleaning melt rosin core solder welding flux 2.0% iron soldering wire for mobile phone electronic components welding repair.

PHONEFIX 50g Solder Wire 2% Flux / High Purity Rosin Core / Low Melting Point for Phone Wiring Repair

Specification :
  • Materials: Tin and lead
  • Weight: 50g
  • Wire Diameter: 0.3/0.5/0.8/1.0mm
  • Flux Content: 2.0(%)
  • Melting Point: about 290(°C)
  • Type: Rosin Core Solder Wire
  • Shape: Small roll type
  • Uses: electronic components Welding repair

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