Amaoe BGA Reballing Stencils Kit Steel Template Net MSM8974 MSM8274 For Xiaomi Mi4 Mobile Phone Soldering Rework Repair
Product Features :
- Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Professional Tin plant steel mesh for MSM8974 universal upper lower layer soldering repair.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Can work great with any universal phone repair BGA rework station MTK CPU series Tin plant net .
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Imported Japan Steel Sheet
- Color: As Pictures Show
- Type: Amaoe Universal BGA Reballing Template
- Model Number: For MSM8974 Tin Plant Stencil Template
- Thickness: 0.12mm
- Design: Heat Dissipating Holes Design
- Application: For MSM8974 Universal Phone BGA Reballing Soldering Repair
- Unit Type: Piece
- Suitable for: for General Rework Station
- Function: for Phone BGA Reballing
Package includes :
- 1pcs x BGA Reballing Stencil
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