Amaoe BGA Reballing Stencils Kit MSM8974 For Xiaomi Mi4 Repair

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Amaoe BGA reballing stencil MSM8998 MSM8974 for Xiaomi CPU IC chip re-tinning soldering repair template net, MSM8974 MSM8274 for Xiaomi Mi 4 CPU mobile phone rework repair BGA reballing stencils kit, high quanlity BGA reballing stencil template, CPU IC chip BGA soldering chipset for Xiaomi 4 NOTE/3S MSM8974/8274/8674/CPU reballing repair net

Amaoe BGA Reballing Stencils Kit Steel Template Net MSM8974 MSM8274 For Xiaomi Mi4 Mobile Phone Soldering Rework Repair

Product Features :
  1. Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
  2. Super thin thickness, just 0.12mm, easy to use.
  3. Professional Tin plant steel mesh for MSM8974 universal upper lower layer soldering repair.
  4. Special designed: Heat dissipating holes design.
  5. High quality steel material, can work great with any universal phone repair BGA rework station.
  6. Can work great with any universal phone repair BGA rework station MTK CPU series Tin plant net .
  7. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: BGA Reballing Stencil Template
  • 100%: High quality
  • Material: Imported Japan Steel Sheet
  • Color: As Pictures Show
  • Type: Amaoe Universal BGA Reballing Template
  • Model Number: For MSM8974 Tin Plant Stencil Template
  • Thickness: 0.12mm
  • Design: Heat Dissipating Holes Design
  • Application: For MSM8974 Universal Phone BGA Reballing Soldering Repair
  • Unit Type: Piece
  • Suitable for: for General Rework Station
  • Function: for Phone BGA Reballing 

Package includes :

  • 1pcs x BGA Reballing Stencil

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