Amaoe BGA Reballing Stencils Template For Huawei P8 P9 Solder Net

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$2.50 $4.50


Huawei P8 P9 HI6220 HI6250 MSM8952 CPU BGA reballing stencils template kit, Huawei P8 P9 universal BGA rework reballing for mobile phone solder rework tool, HI6220 6250 MSM8952 CPU BGA reballing stencils kit, Huawei P8 P9 CPU BGA reballing assistant, CPU BGA reballing stencils kit for Huawei Android mobile phone circuit board CPU chip repairs

Amaoe CPU Series BGA Reballing Stencils Kit Soldering Repair Template Net For Huawei P8 P9 Motherboard Welding Repair

Product Features :
  1. Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
  2. Super thin thickness, just 0.12mm, easy to use.
  3. Professional Tin plant steel mesh for Huawei P8 P9 soldering repair.
  4. Special designed: Heat dissipating holes design.
  5. High quality steel material, can work great with any universal phone repair BGA rework station.
  6. Can work great with any universal phone repair BGA rework station.
  7. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: BGA Reballing Stencil Template
  • 100%: High quality
  • Material: Imported Japan Steel Sheet
  • Color: As Pictures Show
  • Type: Amaoe Universal BGA Reballing Template
  • Model Number: For HI6220 6250 MSM8952 Tin Plant Stencil Template
  • Thickness: 0.12mm
  • Design: Heat Dissipating Holes Design
  • Application: For HI6220 6250 MSM8952 Universal Phone BGA Reballing Soldering Repair
  • Unit Type: Piece
  • Suitable for: for General Rework Station
  • Function: for Phone BGA Reballing 

Package includes :
  • 1pcs x BGA Reballing Stencil

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