Amaoe CPU BGA Reballing Stencil Template MSM8953 Steel Mesh

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Option: MSM8953/1AB
Price:
$2.50 $4.50

Description

Amaoe MSM8953 CPU BGA reballing stencil template for mobile phone soldering rework repair, 0.12mm CPU IC BGA rework repair reballing stencil template - square / rectangle, MSM8953 CPU BGA soldering repair rework reballing stencil template steel mesh, 0.12mm BGA reballing stencil will work great for professional cell phone CPU chip repair

Amaoe MSM8953 CPU BGA Reballing Stencil Template Square / Rectangle BGA Steel Mesh For Mobile Phone Soldering Repair Rework

[ Optional Types ] :
  • Option 1- Square: MSM8953/1AB
  • Option 2- Rectangle: MSM8953/B01-AB

Product Features :
  1. Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
  2. Super thin thickness, just 0.12mm, easy to use.
  3. Special designed: Heat dissipating holes design.
  4. High quality steel material, can work great with any universal phone repair BGA rework station.
  5. Can work great with any universal phone repair BGA rework station MTK CPU series Tin plant net .
  6. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: BGA Reballing Stencil Template
  • 100%: High quality
  • Material: Imported Japan Steel Sheet
  • Color: As Pictures Show
  • Type: Amaoe Universal BGA Reballing Template
  • Model Number: For MSM8953 Tin Plant Stencil Template
  • Thickness: 0.12mmDesign: Heat Dissipating Holes Design
  • Application: For MSM8953 Universal Phone BGA Reballing Soldering Repair
  • Unit Type: Piece
  • Suitable for: for General Rework Station
  • Function: for Phone BGA Reballing 


Package includes :

  • 1pcs x BGA Reballing Stencil

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