Amaoe MSM8953 CPU BGA Reballing Stencil Template Square / Rectangle BGA Steel Mesh For Mobile Phone Soldering Repair Rework
[ Optional Types ] :
- Option 1- Square: MSM8953/1AB
- Option 2- Rectangle: MSM8953/B01-AB
Product Features :
- Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Can work great with any universal phone repair BGA rework station MTK CPU series Tin plant net .
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Imported Japan Steel Sheet
- Color: As Pictures Show
- Type: Amaoe Universal BGA Reballing Template
- Model Number: For MSM8953 Tin Plant Stencil Template
- Thickness: 0.12mmDesign: Heat Dissipating Holes Design
- Application: For MSM8953 Universal Phone BGA Reballing Soldering Repair
- Unit Type: Piece
- Suitable for: for General Rework Station
- Function: for Phone BGA Reballing
Package includes :
- 1pcs x BGA Reballing Stencil
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