Huawei P7 HI6620 Series CPU BGA Reballing Stencils Template For Mobile Phone Circuit Board Soldering Repair Rework Net
Product Features :
- Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Professional Tin plant steel mesh for HI6620 universal upper lower layer soldering repair.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Can work great with any universal phone repair BGA rework station MTK CPU series Tin plant net .
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Imported Japan Steel Sheet
- Color: As Pictures Show
- Type: Amaoe Universal BGA Reballing Template
- Model Number: For HI6620 Tin Plant Stencil Template
- Thickness: 0.12mm
- Design: Heat Dissipating Holes Design
- Application: For HI6620 Universal Phone BGA Reballing Soldering Repair
- Unit Type: Piece
- Suitable for: for General Rework Station
- Function: for Phone BGA Reballing
Package includes :
- 1pcs x BGA Reballing Stencil