Amaoe Huawei Series CPU BGA Soldering Stencils Kit HI3650 HI6250

Option: HU:1


Amaoe multi-purpose Huawei series BGA reballing stencils kit for Android phone CPU motherboard soldering repair net, BGA stencil direct heating reballing stencil for Huawei repair, HI3650 HI6250 HI3660 BGA reballing stencil template for Huawei mobile phone repair, 0.12mm BGA reballing stencil dedicate kit for Huawei CPU BGA IC chips directly heating

Amaoe HI3630 HI3650 Huawei Series CPU BGA Reballing Stencils Kit 0.12mm Soldering Template For Andriod Mobile Phone Repair

[ Optional Types ] :
  • Option 1: HU:1 HI3650 A/B HI3660 A/B HI3630A/B
  • Option 2: HU:2 HI6250 HI3660 A/B HI6220

Product Features :
  1. Amaoe Imported Japan for universal phone BGA reballing stencil template
  2. 100% new brand and high quality.
  3. Super thin thickness, just 0.12mm, easy to use.
  4. Special designed: Heat dissipating holes design.
  5. High quality steel material, can work great with any universal phone repair BGA rework station.
  6. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: BGA Reballing Stencil Template
  • 100%: High quality
  • Material: Imported Japan steel sheet
  • Color: As pictures show
  • Type: Amaoe universal BGA reballing template
  • Thickness: 0.12mm
  • Design: Heat dissipating holes design
  • Application: For Huawei phone BGA reballing soldering repair
  • Unit Type: Piece
  • Suitable for: for general rework station
  • Function: for phone BGA reballing

Package includes :
  • 1pcs x BGA Reballing Stencil

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